About Xinxu
Company Profile
Fuzhou Xinxu Technology Co., Ltd.
The company is a National High-Tech Enterprise, a National “Specialized, Specialized, and New Little Giant” Enterprise, a Provincial Innovative Enterprise, a Provincial Small, Medium, and Micro-Technology Leading Enterprise, a Provincial Ceramic Packaging Materials Enterprise Engineering and Technology Research Center, a Fujian Province Intellectual Property Advantage Enterprise, and a Municipal Enterprise Technology Center. The company currently specializes in the production and R&D of electronic ceramics, microelectronic packaging products, and LED lighting products. Many of its products have won national, provincial, and municipal scientific research achievement awards; in 2008, its surface-mount integrated circuit low-temperature glass packaging was recognized as a National Key New Product and a Provincial Excellent New Product.
The company holds three national invention patents, 34 utility model patents, and two design patents. Its electronic packaging covers are widely used in crystal oscillators, resonators, surface acoustic wave filters (SAW), and integrated circuits, and are sold nationwide and exported worldwide. The company is a leading domestic manufacturer of integrated circuit black ceramic low-temperature glass packaging (CERDIP and CFP), primarily used in the military, automotive, medical device, and microelectronic packaging applications requiring high quality and reliability. Its products are sold to over a dozen provinces, municipalities, and autonomous regions, including Beijing, Shanghai, Shenzhen, Chongqing, Xi’an, Jiangsu, Gansu, Liaoning, Hunan, and Guizhou. In 2015, the company invested RMB 10 million in a new CFP package shell and lead frame project, and its products are supplied to the United States and other countries.
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